Surfaces, Coatings and Films

Standish, T. E., Braithwaite, L. J., Shoesmith, D. W., & Noël, J. J. (2019). Influence of Area Ratio and Chloride Concentration on the Galvanic Coupling of Copper and Carbon Steel. Journal Of The Electrochemical Society, 166(11), C3448-C3455. http://doi.org/10.1149/2.0521911jes

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Martino, T., Chen, J., Guo, M., Ramamurthy, S., Shoesmith, D. W., & Noël, J. J. (2019). Comments on E. Huttunen-Saarivirta et al., “Kinetic Properties of the Passive Film on Copper in the Presence of Sulfate-Reducing Bacteria” [J. Electrochem. Soc., 165, C450 (2018)]. Journal Of The Electrochemical Society, 166(10), Y13-Y16. http://doi.org/10.1149/2.0761910jes

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Martino, T., Smith, J., Chen, J., Qin, Z., Noël, J. J., & Shoesmith, D. W. (2019). The Properties of Electrochemically-Grown Copper Sulfide Films. Journal Of The Electrochemical Society, 166(2), C9-C18. http://doi.org/10.1149/2.0321902jes

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Senior, N. A., Newman, R. C., Artymowicz, D., Binns, W. J., Keech, P. G., & Hall, D. S. (2019). Communication—A Method to Measure Extremely Low Corrosion Rates of Copper Metal in Anoxic Aqueous Media. Journal Of The Electrochemical Society, 166(11), C3015-C3017. http://doi.org/10.1149/2.0031911jes

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